Take advantage of the BUFFER station of our DSVC (Dual Slot Vacuum Chuck) and DSEG (Dual Slot Edge Grip) aligners for swapping wafers to save wafer handling steps.
Also, attaching OCR at the aligner, further improves system throughputs.
Double slots for swapping wafers, edge grip chuck, contact only the edge of the wafer. Lift pins to raise wafer to upper slot location.
Patented soft touch technology, grippers apply contantly monitored force, no streee to the wafer.
Align 300mm wafers. Replacement of ASYST EG-300 Aligners.
Double slots for swapping wafers, vacuum chuck spins the wafer, and grippers center and lower the wafer from upper slot on to the chuck.
Patented soft touch technology, grippers apply constantly monitored force, no stress to the wafer.
Align 200mm and 300mm wafers. Replacement of EQIP/PRI PRE Aligners.